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1

A three-stage identification approach for hysteretic systems

Chin-Hsiung Loh, Sheng-Tsai Chung

Journal:

Earthquake Engineering & Structural Dynamics

Year:

1993

Language:

english

File:

PDF, 1.03 MB

english, 1993

2

Energy Release Rate Estimation for Through Silicon Vias in 3-D IC Integration

Ming-Che Hsieh,, Sheng-Tsai Wu,, Chung-Jung Wu,, Lau, John H.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2014

Language:

english

File:

PDF, 3.42 MB

english, 2014

3

Characterization of Pt-Cu binary catalysts for oxygen reduction for fuel cell applications

Chung-Jen Tseng, Sheng-Tsai Lo, Shen-Chuan Lo, Peter P. Chu

Journal:

Materials Chemistry and Physics

Year:

2006

Language:

english

File:

PDF, 764 KB

english, 2006

4

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Thermo-mechanical analysis of thermoelectric modules

Li, Sheng-Liang, Liu, Chun-Kai, Hsu, Chung-Yen, Hsieh, Ming-Che, Dai, Ming-Ji, Wu, Sheng-Tsai

Year:

2010

Language:

english

File:

PDF, 366 KB

english, 2010

5

Dynamic functional performance and kinematic analysis of the rotational patterns of single- versus double-bundle anterior cruciate ligament reconstruction

Kuo-Chung Cheng, Wu-Chou Chen, Hung-Maan Lee, Jui-Tien Shih, Sheng-Tsai Hung, Lung-Shing Lee

Journal:

Formosan Journal of Musculoskeletal Disorders

Year:

2012

Language:

english

File:

PDF, 841 KB

english, 2012

6

Clinical results of shoulder arthroscopy combined with an open modified Latarjet procedure for chronic anterior shoulder instability with glenoid bony loss

Wei-Yu Shih, Kuo-Chung Cheng, Sheng-Tsai Hung, Hung-Maan Lee, Jui-Tien Shih

Journal:

Formosan Journal of Musculoskeletal Disorders

Year:

2012

Language:

english

File:

PDF, 723 KB

english, 2012

7

Common peroneal nerve palsy as a postoperative complication in lateral meniscus repair

Liao, Chung-Ping, Lee, Hung-Maan, Shih, Jui-Tien, Hung, Sheng-Tsai

Journal:

Formosan Journal of Musculoskeletal Disorders

Year:

2013

Language:

english

File:

PDF, 499 KB

english, 2013

8

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Linz, Austria (2011.04.18-2011.04.20)] 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Energy release rate investigation for through silicon vias (TSVs) in 3D IC integration

Hsieh, Ming-Che, Wu, Sheng-Tsai, Wu, Chung-Jung, Lau, John H., Tain, Ra-Min, Wei-Chung Lo,

Year:

2011

Language:

english

File:

PDF, 3.26 MB

english, 2011

9

[IEEE 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2013.10.22-2013.10.25)] 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Analytical description of the out-of-plane equivalent mechanical properties of through-silicon via interposers

Chen, Cheng-fu, Wu, Sheng-Tsai, Dai, Ming-Ji, Chien, Heng-Chieh, Chen, Chang-Sheng, Lo, Wei-Chung

Year:

2013

Language:

english

File:

PDF, 666 KB

english, 2013

10

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Ultra low-cost through-silicon holes (TSHs) interposers for 3D IC integration SiPs

Wu, Sheng-Tsai, Lau, John H., Chien, Heng-Chieh, Hung, Jui-Feng, Dai, Ming-Ji, Chao, Yu-Lin, Tain, Ra-Min, Lo, Wei-Chung, Kao, Ming-Jer

Year:

2012

Language:

english

File:

PDF, 1.73 MB

english, 2012

11

Thermal Performance of 3D IC Package with Embedded TSVs

Tain, Ra-Min, Dai, Ming-Ji, Chao, Yu-Lin, Li, Sheng-Liang, Chien, Heng-Chieh, Wu, Sheng-Tsai, Li, Wei, Lo, Wei-Chung

Journal:

Transactions of The Japan Institute of Electronics Packaging

Year:

2012

Language:

english

File:

PDF, 2.90 MB

english, 2012

12

Thermal Performance of 3D IC Package with Embedded TSVs

Tain, Ra-Min, Dai, Ming-Ji, Chao, Yu-Lin, Li, Sheng-Liang, Chien, Heng-Chieh, Wu, Sheng-Tsai, Li, Wei, Lo, Wei-Chung

Journal:

Transactions of The Japan Institute of Electronics Packaging

Year:

2012

File:

PDF, 2.90 MB

2012

13

Retrospective analysis of endoscopic management of foreign bodies in the upper gastrointestinal tract of adults

Lee, Chung-Ying, Kao, Bi-Zhen, Wu, Chia-shin, Chen, Ming-Yao, Chien, Hsi-Yuan, Wu, Li-Wei, Lin, Sheng-Tsai, Lai, Yu-Hsin, Lin, Hwai-Jeng

Journal:

Journal of the Chinese Medical Association

Year:

2019

File:

PDF, 265 KB

2019

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